Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate
1999-04-02
2001-11-13
Edwards, Laura (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
C156S299000, C156S297000, C156S573000
Reexamination Certificate
active
06315024
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic-part mounting apparatus for mounting electronic parts on a printed-wiring board and more particularly to an electronic-part mounting apparatus for manually mounting chip-type electronic parts on a printed-wiring board.
2. Description of the Related Art
An electronic-part mounting apparatus for mounting electronic parts on a printed-wiring board, particularly an automatic electronic-part mounting apparatus for automatically mounting electronic parts are widely known.
An automatic electronic-part mounting apparatus will be described with reference to
FIG. 1
by way of example. The automatic electronic-part mounting apparatus shown in
FIG. 1
has an electronic-part supply device
210
for continuously supplying chip-type electronic parts, a mounting head
220
for carrying the electronic parts to a positioning position on a printed-wiring board
50
with holding the electronic parts by attraction, a positioning unit
221
for positioning the electronic parts at the positioning position, and an XY table
230
for supporting the printed-wiring board
50
so that the printed-wiring board
50
can be moved in the X and Y directions.
The chip-type electronic parts have various types or various shapes. Typically, the chip-type electronic parts have a rectangular shape and have, in view of a dimension, a width ranging from 1.0 to 1.2 mm, a length ranging from 1.8 mm to 2.0 mm and a height ranging from 0.4 to 0.5 mm.
The electronic-part supply device
210
employs a so-called carrier tape system. In the carrier tape system, the chip-type electronic parts are taped at a constant interval by a long carrier tape
211
wound around a reel. The carrier tape
211
is usually formed of two tapes, i.e., a top tape on its front side and a bottom tape on its rear side, and the electronic parts are supported while being gripped between the two tapes. A plurality of part cassettes
212
each including such reel are loaded onto the electronic-part supply device
210
.
The electronic-part supply deice
210
may employ a system of supplying chip-type electronic parts individually housed in a bulk case other than the carrier tape system. The system of individually supplying the electronic parts is called a bulk feeder in which the electronic parts are housed in a plastic bulk case and the bulk case is loaded onto the electronic-part supply device.
The mounting head
220
has a rotary table
222
which can be rotated about a center axis and a plurality of attracting nozzles
223
. The attracting nozzles
223
are fitted along a circumferential direction of the rotary table
222
. As the rotary table
222
is rotated, the attracting nozzles
223
are also rotated. The attracting nozzles
223
are moved among an attracting position where the attracting nozzles
223
attract the electronic parts supported on the carrier tape
211
, the positioning position where the positioning unit
221
positions the electronic parts, and a mounting position where the electronic parts are mounted on the printed-wiring board
50
.
An operation of the automatic electronic-part mounting apparatus will subsequently be described. Initially, the printed-wiring board
50
is conveyed from a loading station onto the XY table
230
. The attracting nozzle
223
located at the attracting position attracts the chip-type electronic parts, and the rotary table
222
is rotated. Thereafter, the attracting nozzle
223
is moved to the positioning position.
At the positioning position, the positioning unit
221
positions the electronic parts. When the operation of positioning the electronic parts is finished, the rotary table
222
is rotated and consequently the attracting nozzle
223
is moved to the mounting position. At the mounting position, the attracting nozzle
223
is lifted down to mount the electronic parts, which the attracting nozzle has held, on the printed-wiring board
50
.
When the electronic parts are mounted on the printed-wiring board
50
, the XY table
230
is moved to the next mounting position. When this operation is repeatedly carried out and consequently all the electronic parts have been mounted on the printed-wiring board, the printed-wiring board
50
is returned to the initial position. Finally, the printed-wiring board
50
is ejected from the XY table
230
to an unloading position. This sequential operation is repeated.
According to the automatic electronic-part mounting apparatus shown in
FIG. 1
, the chip-type electronic parts are successively mounted on the printed-wiring board
50
one by one. Every time when one of the chip-type electronic parts is mounted on the printed-wiring board, the attracting nozzle
223
must be lifted down and up. Thereafter, the rotary table
222
is rotated and then the attracting nozzle
223
is lifted down and up again. Operations of the attracting nozzle
223
and the rotary table
232
are carried out in a predetermined order.
In order to carry out efficiently the electronic-part mounting process, it is necessary to reduce a time required for mounting one electronic part. For this end, it may be sufficient to increase speeds of movements of the attracting nozzle
223
and the rotary table
222
. However, even if the speeds are increased, it is impossible to reduce the time required for mounting one electronic part beyond a certain extent. Therefore, it is impossible to increase the speeds beyond the limit.
Even if the time required for mounting one electronic part can be reduced, a time required for carrying out the electronic-part mounting process becomes longer as the number of the electronic parts to be mounted on one printed-wiring board
50
is increased.
When the automatic electronic-part mounting apparatus shown in
FIG. 1
is employed, if the number of the electronic parts to be mounted is increased or if it is necessary to carry out the mounting operation at higher speed, then the apparatus tends to become large in size and to become complicated, which requires more costs and limits a room where the apparatus is located.
Since the automatic electronic-part mounting apparatus shown in
FIG. 1
is arranged so as to automatically mount the electronic parts on the printed-wiring board
50
, the conventional automatic electronic-part mounting apparatus shown in
FIG. 1
requires a drive mechanism and a control device, which complicates an arrangement of the automatic electronic-part mounting apparatus shown in FIG.
1
and makes a size thereof larger.
The automatic electronic-part mounting apparatus shown in
FIG. 1
employs a process for checking the electronic parts mounted on the printed-wiring board
50
. This checking process is carried out by using a considerable expensive apparatus utilizing a video processing technique, for example, or the like. Therefore, the automatic electronic-part mounting apparatus shown in
FIG. 1
inevitably includes the disadvantage that its arrangement becomes complicated and hence costs of equipment is increased.
SUMMARY OF THE INVENTION
In view of such aspects, it is an object of the present invention to provide an electronic-part mounting apparatus which is arranged so as to be able to simultaneously mount a plurality of chip-type electronic parts on a printed-wiring board.
In view of such aspects, it is another object thereof to provide an electronic-part mounting apparatus having a small size and a simple arrangement.
According to a first aspect of the present invention, a manual adhesive coating apparatus includes a base plate having a supporting member for supporting a printed-wiring board and an adhesive storage groove for storing an adhesive, and a pressing plate portion to which a large number of needles are fitted, being arranged such that the needles are brought in contact with the adhesive stored in the adhesive storage groove to put the adhesive on the needles and the needles with the adhesive are brought in contact with the printed-wiring board supported by the supporting member, thereby the adhesive being coated
Edwards Laura
Frommer William S.
Frommer Lawrence & Haug LLP.
Ryan Matthew K.
Sony Corporation
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