Management system, apparatus, and method, exposure...

Details Management system, apparatus, and method, exposure... Management system, apparatus, and method, exposure...

2006-01-31

2006-01-31

Lauchman, Layla G. (Department: 2877)

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

C356S400000, C355S053000, C355S055000, C355S067000, C700S108000, C700S028000, C700S029000, C700S051000

Reexamination Certificate

active

06992767

ABSTRACT:
An exposure apparatus performs AGA measurement by using a predetermined sample shot group formed on a wafer, and decides an alignment parameter. The exposure apparatus executes wafer alignment processing and exposure processing by using the alignment parameter. The exposure apparatus notifies a central processing unit (4) of AGA measurement results and the alignment parameter. An overlay inspection apparatus measures an actual exposure position on the exposed wafer, and notifies the central processing unit of the measurement result. The central processing unit (4) optimizes alignment processing on the basis of the AGA measurement results, alignment parameter, and actually measured exposure position.

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