Malfunction-detection method during die clamping step in...

Details Malfunction-detection method during die clamping step in... Malfunction-detection method during die clamping step in...

2005-06-14

2005-06-14

Rofsass, Jeffery (Department: 2636)

Communications: electrical

Condition responsive indicating system

Specific condition

C340S686100, C264S040100

Reexamination Certificate

active

06906631

ABSTRACT:
The present invention relates to a method of detecting a malfunction during a die clamping step in an injection molding machine. A reference pattern is taken which shows a relation between a die clamping force and a position of a movable platen when die clamping is normally carried out. One or more monitoring sections are set in advance with respect to that position on the basis of the reference pattern and an allowable limit value of a die clamping force in the respective monitoring sections is also set in advance in a form of a linear function of the position. The die clamping force is monitored in the respective monitoring section during a respective die clamping step and, when its value exceeds the allowable limit value, it is decided that a malfunction occurs and an alarm is issued.

REFERENCES:
patent: 5346657 (1994-09-01), Hara et al.
patent: 5753153 (1998-05-01), Choi
patent: 6093361 (2000-07-01), Schad
patent: 2002/0158359 (2002-10-01), Matsubayashi et al.
patent: 9-85792 (1997-03-01), None
patent: 2001-30326 (2001-02-01), None

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