Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1991-10-31
1993-12-21
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257788, 257795, H01L 2328
Patent
active
052723771
ABSTRACT:
The device characteristics is in containing a maleimide resin with a content of 0.2 weight percent of less of an organic acid, a phenolic resin, and a combination of a basic catalyst and a peroxide as a curing catalyst. In addition, additives as a mold release agent such as a polyethylene wax and an inorganic filler are contained. The maleimide resin composition is prepared in such a manner that a part of the phenolic resin is preblended with the curing catalyst in advance of other components, while the remainder of the phenolic resin is added to the maleimide resin to prepolymerize, and then, the preblend and the prepolyer are blended the other components. The maleimide resin composition has excellent moldability by improvement of curing characteristics through combined use of a basic catalyst and a peroxide as a curing agent. Besides, a resin encapsulated semiconductor device manufactured by encapsulating a semiconductor element with the resin composition has excellent heat resistance and moisture-resistance reliability.
REFERENCES:
patent: 4131632 (1978-12-01), Suzuki et al.
patent: 5070154 (1991-12-01), Shiobara et al.
Database WPIL, AN 87-132566, JP-A-62 072 722, Apr. 3, 1987.
Patent Abstracts of Japan, vol. 12, No. 472 (C-551), Dec. 9, 1988, JP-A-63 191 833, Aug. 9, 1988.
Database WPIL, AN 90-251082, JP-A-2 175709, Jul. 9, 1990.
Database WPIL, AN 89-343294, JP-A-1 254 735, Oct. 11, 1989.
Database WPIL, AN 89-289808, JP-A-1 213 336, Aug. 28, 1989.
Patent Abstracts of Japan, vol. 13, No. 523 (C-657), Nov. 21, 1989, JP-A-1 213 335, Aug. 28, 1989.
Database WPIL, AN 87-112125, JP-A-62 057 420, Mar. 13, 1987.
Fujieda Shinetsu
Higashi Michiya
Shimozawa Hiroshi
Yoshizumi Akira
Kabushiki Kaisha Toshiba
Mintel William
Potter Roy
LandOfFree
Maleimide resin composition and resin encapsulated semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Maleimide resin composition and resin encapsulated semiconductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Maleimide resin composition and resin encapsulated semiconductor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-310957