Maleimide resin composition and resin encapsulated semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

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257788, 257795, H01L 2328

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active

052723771

ABSTRACT:
The device characteristics is in containing a maleimide resin with a content of 0.2 weight percent of less of an organic acid, a phenolic resin, and a combination of a basic catalyst and a peroxide as a curing catalyst. In addition, additives as a mold release agent such as a polyethylene wax and an inorganic filler are contained. The maleimide resin composition is prepared in such a manner that a part of the phenolic resin is preblended with the curing catalyst in advance of other components, while the remainder of the phenolic resin is added to the maleimide resin to prepolymerize, and then, the preblend and the prepolyer are blended the other components. The maleimide resin composition has excellent moldability by improvement of curing characteristics through combined use of a basic catalyst and a peroxide as a curing agent. Besides, a resin encapsulated semiconductor device manufactured by encapsulating a semiconductor element with the resin composition has excellent heat resistance and moisture-resistance reliability.

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Database WPIL, AN 90-251082, JP-A-2 175709, Jul. 9, 1990.
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Patent Abstracts of Japan, vol. 13, No. 523 (C-657), Nov. 21, 1989, JP-A-1 213 335, Aug. 28, 1989.
Database WPIL, AN 87-112125, JP-A-62 057 420, Mar. 13, 1987.

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