Maleic acid and ethylene urea containing formulation for...

Details Maleic acid and ethylene urea containing formulation for... Maleic acid and ethylene urea containing formulation for...

2005-09-20

2005-09-20

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Chemical etching

C134S042000, C510S109000

Reexamination Certificate

active

06946396

ABSTRACT:
A semiconductor wafer cleaning formulation for use in semiconductor fabrication comprising maleic acid and ethylene urea as essential components. The preferred formulation comprises maleic acid, ethylene urea, at least one carboxylic acid except maleic acid, at least one organic amine except ethylene urea and water. The formulation can optionally comprise at least one selected from the group consisting of an organic solvent, a chelating agent and a surfactant. The formulation is suitably used for removal of residue from semiconductor wafers following a resist ashing process, particularly for removal of residue from wafers containing delicate copper interconnect and low-k or ultra low-k interlayer dielectrics structures. There is also provided a method for cleaning the wafer by using the formulation.

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MSDS for 2-Imidazolidinone (i.e. “ethylene urea”), downloaded from http://www.cdc.gov
iosh/rtecs
j8b290.html, 4 pages.
MSDS for “maleic acid”, downloaded from http://www.jtbaker.com/msds/englishhtml/m0325.html, 8 pages.

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