Making solderable printed circuit boards

Details Making solderable printed circuit boards Making solderable printed circuit boards

1982-06-24

1985-06-25

Tufariello, Thomas

Chemistry: electrical and wave energy

Processes and products

29852, 174 685, C25D 502, H01K 342

Patent

active

045252467

ABSTRACT:
An improved process for making a printed circuit board of the type comprising solder-rooted pads and a solder-coated internal wall of each hole in the circuit board. The new process comprises the step of masking over a dry film, e.g. an alkaline ink film, after copper plating and before solder plating. In one embodiment of the invention, a selectively-plated thin layer of solder to act as a resist except on the areas defined by hole pads and barrels but is wholly free of solder which can melt and cause solder-migration problems under the surface of the printed circuit board.

REFERENCES:
patent: 2872391 (1959-02-01), Hauser et al.
patent: 3483615 (1969-12-01), Gottfried
patent: 3673680 (1972-07-01), Tanaka et al.
patent: 3742597 (1973-07-01), Davis
patent: 4104111 (1978-08-01), Mack
patent: 4304640 (1981-12-01), Walker

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