Making nucleic acid sequences in parallel and use

Details Making nucleic acid sequences in parallel and use Making nucleic acid sequences in parallel and use

2006-03-01

2009-06-09

Horlick, Kenneth R. (Department: 1637)

Organic compounds -- part of the class 532-570 series

Organic compounds

Carbohydrates or derivatives

Reexamination Certificate

active

07544793

ABSTRACT:
The present invention relates generally to the fields of genomics, synthetic biology and genetic engineering. More particularly, the present invention concerns the methods that enable parallel multiplex ligation and amplification on surface for making assemblies of nucleic acids of various biological applications and for analysis of biological samples such as DNA, RNA, and proteins.

REFERENCES:
patent: 5942609 (1999-08-01), Hunkapiller et al.
patent: 6245505 (2001-06-01), Todd
patent: 6355431 (2002-03-01), Chee
patent: 6670127 (2003-12-01), Evans
patent: 7164992 (2007-01-01), Mulligan et al.
patent: 2003/0215825 (2003-11-01), Tong
patent: 2003/0219781 (2003-11-01), Frey
patent: 2006/0160138 (2006-07-01), Church et al.
patent: WO 2004/039953 (2004-05-01), None
Barndad, Cynthia, “A DNA, Self-Assembled Monolayer for the Specific Attachment of Unmodified Double- or Single-Stranded DNA,” Biophysical Journal, Oct. 1998, vol. 75, pp. 1997-2003.
Zhou et al., “Microfluidic PicoArray synthesis of oligodeoxynucleotides and simultaneous assembling of multiple DNA sequences,” Nucleic Acids Research, vol. 32, No. 18, pp. 5409-5417.
Sarkar, et al. Nucleic Acids Res. 2005. vol. 33, No. 1, pp. 143-151.

Affiliated with

Also associated with

Rating

Making nucleic acid sequences in parallel and use does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Making nucleic acid sequences in parallel and use, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Making nucleic acid sequences in parallel and use will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4102113