Making hybrid IC with photoresist laminate

Details Making hybrid IC with photoresist laminate Making hybrid IC with photoresist laminate

1977-11-14

1979-09-11

Kimlin, Edward C.

Gas separation: apparatus

Electric field separation apparatus

Electrode cleaner, apparatus part flusher, discharger, or...

96 36, 156293, 156630, 156634, 156659, 427 96, 427238, 427239, G03C 500

Patent

active

041674138

ABSTRACT:
A hybrid integrated circuit package and a method for fabricating the package. The package comprises a ceramic substrate having a blank metallization and feedthroughs screen printed thereon. A ceramic seal ring is joined to the substrate to form the side walls of the package. The substrate metallization is plated with nickel and gold and external leads are brazed to the ends of the feedthroughs. As such the package is suitable for use with a large number of different integrated circuits. The package can be adapted for use with a particular integrated circuit function by selectively patterning the blank substrate metallization. This is accomplished by laminating a preformed piece of dry film photoresist material to the package bottom. This piece of photoresist is then exposed through a photographic mask using a collimated light source.

REFERENCES:
patent: 2736065 (1956-02-01), Wilcox
patent: 3959061 (1976-05-01), Renck et al.
DeForest, "Photoresist, Materials and Processes," Jun. 1975, pp. 176-178, esp. p. 177.

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