Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-07-10
2007-07-10
Harvey, James R. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S091000, C439S591000
Reexamination Certificate
active
10822572
ABSTRACT:
A socket may receive both ball grid and land grid array packages. Thus, in some embodiments, the early package prototypes, without solder balls, may be packaged in the same socket design that is ultimately used for production devices using ball grid array packaging. Both land grid array and ball grid arrays may be self-centered on the socket in some embodiments. An S-shaped spring contact may be utilized to electrically connect to either solder balls or lands in a wiping action.
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Gilbert Scott A.
Kochanowski Michael
Lloyd Shawn L.
Oldendorf John G.
Harvey James R.
Intel Corporation
Trop Pruner & Hu P.C.
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