Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-08-28
2000-04-18
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
324761, G01R 3102
Patent
active
060508299
ABSTRACT:
By segregating at least a substantial portion of the power connections to the space transformer component (506, 700, 800) from the signal connections thereto, constraints on the interposer component (504) may be relaxed. This is particularly advantageous in the context of probing one or more high power semiconductor components. The technique of the present invention provides for a plurality of signals (including power and ground) to be inserted into an electronic component such as a space transformer both from a one main surface thereof and an edge (periphery) thereof to an opposite main surface thereof. The space transformer includes pads (522, 706, 810) for engaging, by means of spring elements (524), component (508) to be tested and includes exposed edge pads (750, 804, 854) for engagement by a flexible cable (752) for transmission of power and ground signals to the space transformer. The system also includes an interposer (504) having resilient contacts (514, 516) for electrically interconnecting a probe card (502) to the space transformer (506).
REFERENCES:
patent: 4084869 (1978-04-01), Yen
patent: 5157325 (1992-10-01), Murphy
patent: 5383787 (1995-01-01), Switky
patent: 5475317 (1995-12-01), Smith
Eldridge Benjamin N.
Grube Gary W.
Khandros Igor Y.
Mathieu Gaetan L.
Abrams Neil
FormFactor Inc.
Larwood David
Linden Gerald E.
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