Making and testing an integrated circuit using high density prob

Details Making and testing an integrated circuit using high density prob Making and testing an integrated circuit using high density prob

1991-10-11

1993-07-06

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 725, 324158F, G01R 104, G01R 1067

Patent

active

052257711

ABSTRACT:
Individual transistor or logic unit testing is accomplished by a specially fabricated flexible tester surface made in one embodiment of several layers of flexible silicon dioxide, each layer containing vias and conductive traces leading to thousands of microscopic metal probe points on one side of the test surface. The probe points electrically contact the contacts on the wafer under test by fluid pressure.

REFERENCES:
patent: 3405361 (1968-10-01), Kattner
patent: 3596228 (1971-07-01), Reed, Jr.
patent: 4070565 (1978-01-01), Borrelli
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4751458 (1988-06-01), Elward, Jr.
patent: 4820976 (1989-04-01), Brown
patent: 4837507 (1989-06-01), Hechtman
patent: 4904935 (1990-02-01), Calma
patent: 4906920 (1990-03-01), Huff et al.
patent: 4931726 (1990-06-01), Kasukabe et al.
patent: 4972143 (1990-11-01), Kamensky et al.
patent: 4993957 (1991-02-01), Shino
patent: 5012187 (1991-04-01), Littlebury
"Probe for MOS Measurements", by Hoekstra, IBM Tech., Disc. Bull., vol. 13, #10, Mar. 1971, pp. 2981-2982.
"Integrated Movable Micromechemical Structures for Sensors and Actuators", by Fan et al., IEEE Trans. on Electron. Dev., vol. 35, #6, Jun. 1988.
IBM Tech. Discl Bull, vol. 24, No. 2A, Dec. 1981, D. O. Powell et al., "Conformal Multi-Probe Tester Assembly" pp. 3342-3344.
IBM, Tech. Discl. Bull., vol. 21, No. 210, K. S. Desai, et al., "Method for Eliminating Paste-Pull Out of Screened Green Sheet" pp. 4029-4030.
Microelectronics and Reliability, vol. 25, No. 4, 1985, A. Singh, et al., "Technique for Lifting Off Thick Film Print Fired on Alumina", pp. 619-620.

Affiliated with

Also associated with

Rating

Making and testing an integrated circuit using high density prob does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Making and testing an integrated circuit using high density prob, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Making and testing an integrated circuit using high density prob will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1692754