Making a connection between a component and a circuit board

Details Making a connection between a component and a circuit board Making a connection between a component and a circuit board

1999-09-09

2001-11-13

Gaffin, Jeffrey (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S262000, C174S263000, C361S760000, C361S772000, C361S773000, C361S779000, C257S698000, C257S779000

Reexamination Certificate

active

06316737

ABSTRACT:

BACKGROUND
This invention relates to making a connection between a component and a circuit board.
U.S. Pat. No. 5,644,103, incorporated by reference, shows two ways to make a soldered connection between conductive runs on an electrical component such as in integrated power device (IPD) and a circuit board.
As shown in
FIG. 1
(reproduced from FIG. 9 of the patent), in one approach solder
79
connects the inner wall of a metal-lined-through-hole
45
a
in a circuit board
17
to the surface of a pad
71
that lies on the IPD. The connection is made by reflowing solder using heat from a heat plate
81
or heat stored in base plate
15
of the IPD. In another approach, shown in
FIG. 2
(reproduced from FIG. 12 of the patent), hole
45
a
is replaced by a scallop
83
at the edge of a component hole
45
. The scallop permits the solder to form a filleted joint
87
.
SUMMARY
In general, in one aspect, the invention features a connection between a through-hole in a circuit board and a contact region on a component. The contact region has a surface that bears a depression. A continuous solder column has one end that forms a solder joint with an inner wall of the through-hole and another end that forms a solder joint with the contact region.
Implementations of the invention may include one or more of the following features. The contact region may include a concave curved depression in the surface of the connection pad. The contact region may be formed on a connection pad, and the depression may have a depth that is at least ¾ of the thickness of the connection pad. The component may be an IPD coated with parylene. The contact may be formed by laser ablation. The solder column may be formed by placing a volume of solder in the through-hole and reflowing the solder in the through-hole to cause it to form a solder joint with an inner wall of the through-hole and a solder joint with the contact region.
ADVANTAGES
Among the advantages of the invention are one or more of the following.
The connections are mechanically strong and resistant to breaking under shear forces that may occur during fabrication and use of the associated circuit. The position and quality of the connections are uniform from unit to unit. Consistent volumes of solder are used from unit to unit. The connections are strong and long-lasting.
Other advantages and features will become apparent from the following description and from the claims.


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Nickols

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