Maintaining uniformity of deposited film thickness in plasma-enh

Details Maintaining uniformity of deposited film thickness in plasma-enh Maintaining uniformity of deposited film thickness in plasma-enh

1992-11-02

1996-02-13

Bueker, Richard

Coating apparatus

Gas or vapor deposition

With treating means

118728, 118500, 118715, C23C 1650

Patent

active

054908817

ABSTRACT:
In depositing films upon a plate by use of plasma-enhanced chemical vapor deposition, variations in thickness of the film that normally occur at the edges of the plate are reduced by positioning a frame of tiles around the plate. The frame provides a sacrificial edge at which thickness variations at the edge of the film can occur. After deposition, removal of the frame results in improved uniformity of film thickness on the plate itself.

REFERENCES:
patent: 3645545 (1922-02-01), Garnache
patent: 4223048 (1980-09-01), Engle
patent: 4612207 (1986-09-01), Jansen
patent: 4767641 (1988-08-01), Kieser
patent: 4823736 (1989-04-01), Post
patent: 4834022 (1989-05-01), Mahawili
patent: 4993360 (1991-02-01), Nakamura
patent: 5116181 (1992-05-01), Severns

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