Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-06-20
2006-06-20
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S697000, C174S016300, C165S080300
Reexamination Certificate
active
07064954
ABSTRACT:
A mainframe cooling structure is disclosed to include a body, which has a side cover and a ventilation grille at the side cover for letting air in and out, a circuit board, which is fixedly mounted inside the body and has an electronic device that produces heat during operation, and a cooler module, which includes a heat sink attached to the electronic device, a fan holder provided at the top side of the heat sink, and two fans mounted in the fan holder and aimed at different parts of the ventilation grille for drawing outside cooling air toward the heat sink and drawing inside hot air out of the body.
REFERENCES:
patent: 5946188 (1999-08-01), Rochel et al.
patent: 5991153 (1999-11-01), Heady et al.
patent: 6735081 (2004-05-01), Bishop et al.
patent: 6804115 (2004-10-01), Lai
Chiu Chuan-Chun
Hsu Chia-Yen
Wu Chia-Chuan
Chervinsky Boris
Datavan Internatoinal Corp.
LandOfFree
Mainframe cooling structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mainframe cooling structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mainframe cooling structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3635935