Mainframe cooling structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S697000, C174S016300, C165S080300

Reexamination Certificate

active

07064954

ABSTRACT:
A mainframe cooling structure is disclosed to include a body, which has a side cover and a ventilation grille at the side cover for letting air in and out, a circuit board, which is fixedly mounted inside the body and has an electronic device that produces heat during operation, and a cooler module, which includes a heat sink attached to the electronic device, a fan holder provided at the top side of the heat sink, and two fans mounted in the fan holder and aimed at different parts of the ventilation grille for drawing outside cooling air toward the heat sink and drawing inside hot air out of the body.

REFERENCES:
patent: 5946188 (1999-08-01), Rochel et al.
patent: 5991153 (1999-11-01), Heady et al.
patent: 6735081 (2004-05-01), Bishop et al.
patent: 6804115 (2004-10-01), Lai

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mainframe cooling structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mainframe cooling structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mainframe cooling structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3635935

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.