Main power inductance based on bond wires for a switching...

Details Main power inductance based on bond wires for a switching... Main power inductance based on bond wires for a switching...

2006-10-10

2006-10-10

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S697000, C257S690000, C257S691000, C257S692000, C438S106000, C438S612000

Reexamination Certificate

active

07119448

ABSTRACT:
A method for providing main power inductance to a switching power supply using bond wires of an integrated circuit packaging. A predetermined number of bond wires are connected serially between standalone die bond pads and no-connect pins of the packaging. An output of the switching power supply is connected to a first bond wire, and an output pin of the integrated circuit is connected to a last bond wire. A number of the bond wires, a length and a diameter of each bond wire, and a distance of the bond wires from a die attach paddle may be pre-selected to determined the main power inductance.

REFERENCES:
patent: 5576680 (1996-11-01), Ling
patent: 5869888 (1999-02-01), Tsubosaki et al.
patent: 5986345 (1999-11-01), Monnot
patent: 6121678 (2000-09-01), Chiu et al.
patent: 6246107 (2001-06-01), Silvestre
patent: 6586309 (2003-07-01), Yeo et al.
patent: 6661083 (2003-12-01), Lee et al.
patent: 6713849 (2004-03-01), Hasebe et al.
O'Donnell et al, “Thin Film Micro-Transformers for Future Power Conversion,” (2004) (pp. 939-944).

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