Mailer for laser printer

Envelopes – wrappers – and paperboard boxes – Wrapper – Letter sheets

Patent

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Details

B65D 2704, B65D 2714

Patent

active

048983233

ABSTRACT:
A one piece mailer includes a standard size sheet which may be employed in laser printers or xerographic machines without special equipment and involves printing on one side only of the mailer. Stable adhesive material which will not run or contaminate the office machines, when it is subject to several hundred degrees heat is used for sealing. This adhesive is preferably water-activated. One embodiment includes a mailing sheet having an upper and lower half, with the upper half carrying the addresses and the message, and the lower half having windows which match the location of the addresses on the upper half of the mailer. The second embodiment involves a mailer having a first full sheet having an upper portion on which messages are printed, and a lower portion on which addresses are printed. On the rear side of the main sheet is a short partial sheet toward the bottom of the main sheet forming an envelope, and with a transverse strip of adhesive immediately above the envelope pocket to seal the envelope. Perforations extend across the main sheet just above the adhesive-coated strip, so that the message section may be separated from the envelope portion, and the message portion folded and placed within the envelope, and the envelope sealed. The third embodiment uses overlying message and envelope sheets, and is similar to the first embodiment in the use of windows in the envelope sheet which expose addresses from the folded message sheet.

REFERENCES:
patent: 122041 (1871-12-01), Ludlow
patent: 225319 (1880-03-01), Barton
patent: 2152135 (1939-03-01), Case et al.
patent: 3093296 (1963-06-01), Wood
patent: 3197121 (1965-07-01), Hayes
patent: 3937492 (1976-02-01), Biron
patent: 4031818 (1977-06-01), Kehoe
patent: 4044942 (1977-08-01), Sherwood
patent: 4102489 (1978-07-01), Lucas
patent: 4575121 (1986-03-01), Conti
patent: 4784317 (1988-11-01), Chen et al.

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