Magnetron with plurality of targets in correspondence to shield

Details Magnetron with plurality of targets in correspondence to shield Magnetron with plurality of targets in correspondence to shield

1999-05-17

2000-11-07

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429811, 20429808, 20429812, 20429818, 20419212, C23C 1400

Patent

active

061431494

ABSTRACT:
A sputtering apparatus is provided with a wafer holder disposed in a chamber. A wafer is placed on the wafer holder. A target is disposed in the chamber such as to be opposed to the wafer on the wafer holder. The target is divided into a plurality of pieces. In the sputtering apparatus, there are provided a gas controlling device which exhausts air from the chamber and introduces sputtering gas into the chamber, and a power source device which applies voltage to the target. The power source device individually controls the voltage to be applied to each of the divided targets. A shield member is provided in the chamber. The shield member partitions the chamber in correspondence to the divided targets.

REFERENCES:
patent: 3829373 (1974-08-01), Kuehnle
patent: 4468313 (1984-08-01), Okumura et al.
patent: 4485000 (1984-11-01), Kawaguchi et al.
patent: 4505798 (1985-03-01), Ramachandran et al.
patent: 4842706 (1989-06-01), Fukasawa et al.

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