Magnetron sputtering cathode for vacuum coating apparatus

Details Magnetron sputtering cathode for vacuum coating apparatus Magnetron sputtering cathode for vacuum coating apparatus

1991-09-30

1994-02-08

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1435

Patent

active

052845648

ABSTRACT:
In a magnetron sputtering cathode for vacuum coating apparatus with a circular target plate and a plurality of magnet arrangements arranged behind the target plate and with a drive means for the continuous rotation of at least one of the magnet arrangements (12, 12') about the central axis A of the target plate, there is provided, in the radially outer marginal area of the target plate, a first magnet arrangement (15, 15', . . .) for the production of a magnetic tunnel section substantially concentric with the axis of rotation A, and between the axis of rotation A and the first magnet arrangement (15, 15', . . .) and, between the axis of rotation A and the first magnet arrangement (15, 15', . . .), a second magnet arrangement (12, 12') offset radially inwardly, and a third magnet arrangement (11, 11', . . .) which cooperate with the first magnet arrangement (15, 15', . . .) for the production of the magnetic tunnel section which extends substantially over one sector of the target plate, the second magnet system being formed from a group of individual magnets (12, 12') such that, upon a rotation of the second magnet arrangement (12, 12') about the axis of rotation (A) or of a fourth magnet arrangement (13) the surface elements of the target plate are eroded more strongly at the margin, so that a substrate field mounted opposite the target plate becomes uniformly coated.

REFERENCES:
patent: 4444643 (1984-04-01), Garrett
patent: 4746417 (1988-05-01), Ferenbach et al.
patent: 4746417 (1988-05-01), Ferenbach et al.
patent: 5047130 (1991-09-01), Akao et al.
Patent Abstracts of Japan: vol. 8, No. 150 (C-233) (1587) Jul. 12, 1984 and JP-A-59 56 580 (Fujitsu) Apr. 2, 1984, Abstract.
Patent Abstracts of Japan: vol. 14 No. 568 (E-1014) Dec. 18, 1990 and JP-A-02 246 216 (Hitachi) Oct. 2, 1990.
Patent Abstracts of Japan, 2-11761 A, C-702, Mar. 15, 1990, vol. 14, No. 137.
Patent Abstracts of Japan, 63-282263 A, C-576, Mar. 14, 1989, vol. 13, No. 107.

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