Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Reexamination Certificate
2006-10-03
2006-10-03
McDonald, Rodney G. (Department: 1753)
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
C204S298190
Reexamination Certificate
active
07115194
ABSTRACT:
A magnetron sputtering apparatus1is composed of a vacuum chamber2,a target3,a cathode4that holds the target3in the vacuum chamber2,a substrate5,an anode6that holds the substrate5and is allocated above the cathode4so as to face the substrate5toward the target3on the cathode4,a permanent magnet71that generates magnetic field141and is allocated under the cathode4,and a rotation controller12for rotating the permanent magnet71so as to pivot on a center axis of the target3.The permanent magnet71is further composed of a base8,a first permanent magnet91that is fixed on the base8in the middle and a second permanent magnet101in a ring shape that is fixed in an external circumferential area of the base8so as to surround the first permanent magnet91,wherein a magnetic polarity of the second permanent magnet101is inverse with respect to that of the first permanent magnet91and magnetic field strength of the second permanent magnet101is weaker than that of the first permanent magnet91,and further an upper portion of the permanent magnet71is in a cylindrical shape of which top portion is cut diagonally.
REFERENCES:
patent: 4964968 (1990-10-01), Arita
patent: 5399253 (1995-03-01), Grunenfelder
patent: 5439574 (1995-08-01), Kobayashi et al.
patent: 5470452 (1995-11-01), Dickey et al.
patent: 6224725 (2001-05-01), Glocker
patent: 6344114 (2002-02-01), Sichmann et al.
patent: 2241710 (1991-09-01), None
patent: 02-277771 (1990-11-01), None
patent: 04-371575 (1992-12-01), None
patent: 07-166346 (1995-06-01), None
patent: 2002-069637 (2002-03-01), None
Connolly Bove & Lodge & Hutz LLP
McDonald Rodney G.
Victor Company of Japan Ltd.
LandOfFree
Magnetron sputtering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Magnetron sputtering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Magnetron sputtering apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3622892