Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1983-12-27
1985-02-19
Demers, Arthur P.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
204192R, 204192M, C23C 1500
Patent
active
045004099
ABSTRACT:
A novel magnetron sputter coating source is disclosed in which magnetic sputter targets containing relatively large inventories of usable material may be employed. This coating source may also be used efficiently and effectively with sputter target materials having properties which range from nonmagnetic to highly ferromagnetic. Use of an electromagnetic coil with a widely adjustable energizing current, rather than permanent magnets, allows a wide range of magnetic properties to be accommodated. Electrical impedance of the glow discharge is readily controlled using the current flow through the electromagnetic coil, allowing, for example, operation at desired values of voltage and current throughout the life of the sputter target. In addition, a momentary increase in electromagnet coil current can be used to achieve ignition of the glow discharge at a desired sputter gas operating pressure which is below the sputter gas pressure at which the glow discharge can normally be readily ignited. Also, use of the electromagnetic coil permits an easy conversion of the magnetron sputter coating source to a nonmagnetic diode apparatus. The use of a Hall probe positioned adjacent and below the sputter target near the region of maximum erosion is disclosed. The Hall probe voltage, which is proportional to the magnetic field intensity at the Hall probe position, may be measured throughout sputter target life to provide an independent means of assessing the approach to end of useful life. A novel sputter target cooling means is disclosed in which a water chamber below the sputter target is divided into inlet and outlet portions by a septum. The flow of water through a narrow gap between the septum and the sputter target leads to highly effective heat transfer, which is also highly uniform along the peripheral path of intense heating of the sputter target.
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Boys Donald R.
Graves Walter E.
Cole Stanley Z.
Demers Arthur P.
Herbert Leon F.
Varian Associates Inc.
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