Magnetron source for deposition on large substrates

Details Magnetron source for deposition on large substrates Magnetron source for deposition on large substrates

2006-02-27

2009-12-29

Nguyen, Nam X (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298260, C204S298150, C204S298120

Reexamination Certificate

active

07638022

ABSTRACT:
A magnetron source for producing a magnetic field near a surface of a target in a deposition system include a first magnet, a second magnet separated by a gap from the first magnet along a first direction, and a target holder configured to hold the target in the gap between the first magnet and the second magnet. The target includes a sputtering surface from which target material can be sputtered and deposited on a substrate. The target holder is so configured that the sputtering surface is substantially parallel to the first direction and the first magnet and the second magnet can produce a magnetic field near a surface of the target.

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