Magnetron plasma processing system

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

118719, 118723MR, 118723MA, 118723E, 20429816, 2042982, 20429825, 20429837, H01L 2100, C23C 1434, C23C 1600

Patent

active

055542492

ABSTRACT:
A magnetron plasma etching system has a plurality of processing chambers connected to a common transfer chamber. Each processing chamber has a pair of counter electrodes for generating an electric field and a magnet mechanism for generating a magnetic field having an N-S axis crossing the electric field. All magnetic fields are rotated in the same plane. The rotation of the magnetic fields is controlled by a controller. When one of the magnetic fields is rotated, the other magnetic fields are rotated at equal speed such that the directions of N-S axes thereof are parallel and identical to that of the one of the magnetic fields.

REFERENCES:
patent: 4825808 (1989-05-01), Takahashi et al.
patent: 5203945 (1993-04-01), Hasegawa et al.
patent: 5270266 (1993-12-01), Hirano et al.
patent: 5376211 (1994-12-01), Harada et al.
patent: 5387893 (1995-02-01), Oguriyama et al.

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