Magnetron cathode sputtering system

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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204192E, C23C 1500

Patent

active

043929397

ABSTRACT:
In a magnetron cathode sputtering system the target (plate of material to be sputtered) 8 is held against a backing plate 13 by a vacuum, enabling the backing plate 13 to be reused. By providing the backing plate with a layer of soldering material which adheres to the backing plate 13, but does not adhere to the target 8, heat transfer between the two plates is improved.

REFERENCES:
patent: 3616449 (1971-10-01), Pellegrin
patent: 4272355 (1981-06-01), Kennedy
patent: 4274476 (1981-06-01), Garrett
patent: 4297190 (1981-10-01), Garrett
patent: 4341810 (1982-07-01), Lauterbach et al.
van Esdonk et al., Research/Development, Jan. 1975, pp. 41-44.

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