Magnetron cathode sputter coating apparatus

Details Magnetron cathode sputter coating apparatus Magnetron cathode sputter coating apparatus

1987-11-12

1989-04-04

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1434

Patent

active

048183580

ABSTRACT:
In a cathode sputtering apparatus, in order to achieve a very uniform utilization of the target and a high-quality coating on the substrate, the cathode is provided on its side of the target facing away from the substrate with a flat plate on which a plurality of magnets are disposed in rows, the magnets of the individual rows parallel to one another being at approximately equal distances apart and having the same polarity. Moreover, the magnetic of the one row are offset by a dimension g from the magnets of the adjacent row, so that, in the area of the target provided with the coating material, when the cathode is used in a chamber with suitable gas pressure and with a voltage of any desired frequency is applied, plasma tubes form which are like serpentinely curved racetracks.

REFERENCES:
patent: 4407713 (1983-10-01), Zega
patent: 4437966 (1984-03-01), Hope et al.
patent: 4600492 (1986-07-01), Ooshio

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