Magnetron cathode assembly

Details Magnetron cathode assembly Magnetron cathode assembly

1993-04-21

1994-12-20

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1435

Patent

active

053743431

ABSTRACT:
A magnetron sputtering apparatus is provided that is equipped with a magnetron cathode assembly in which the target can be sufficiently sputtered in the central portion to insure that it will not be a cause of particulate contamination and which permits the use of a target of larger diameter without compromising the ability to assure a satisfactorily high film deposition rate. The magnetron cathode assembly comprises basically a flat circular target, a magnetic field applying means provided near the back side of the target, and a rotary driving means for rotating the position of a magnetic field on the surface of the target, and the magnetic field application means includes at least one arrangement in which different spaced magnetic poles are provided to face each other in such a manner that they surround the central portion of the target.

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