Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-11
2007-09-11
Duong, Hung Van (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S104330, C062S435000
Reexamination Certificate
active
11219965
ABSTRACT:
A heat sink uses a pump assembly to generate a magnetic field. Flow directions of electrically and thermally conductive liquid flowing through multiple pipes that go through the pump assembly are dependent on an orientation of the magnetic field and/or the direction of electrical current induced across flowing fluid in the magnetic field. In such a manner, cool liquid may be directed toward a heat source and warmer liquid may be directed to flow away from the heat source, where heat transfer occurs between the liquid and the heat sink. Additional pump assemblies that generate separate magnetic fields may be used to increase fluid flow volume, thereby increasing heat transfer away from the heat source.
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Free Surface Heat Transfer and Innovative Designs for Thin and Thick Liquid Walls, Authors: A.Y. Ying, N. Morley, S. Smolentsev, K. Gulec, and P. Fogarty, Mechanical & Aerospace Engineering Department, UCLA, Los Angeles, CA 90095 Draft copy submitted to ISFNT-5, Rome Sep. 1999; pp. 1-8.
Duong Hung Van
Osha & Liang LLP
Sun Microsystems Inc.
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