Magnetically sealed multichip integrated circuit package

Details Magnetically sealed multichip integrated circuit package Magnetically sealed multichip integrated circuit package

1985-10-03

1987-04-28

Pellinen, A. d.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361400, 357 75, H01L 2302

Patent

active

046618864

ABSTRACT:
A magnetically sealed integrated circuit package includes a substrate having a cavity for holding multiple integrated circuit die, a lid for covering the cavity to protect the die, a ferromagnetic seal ring which is fixed to the substrate around the die, and a magnet which is fixed to the lid and coincides in shape to the seal ring for magnetically attracting the seal ring to hold the lid in place when the lid covers the cavity.

REFERENCES:
patent: 4012723 (1977-03-01), Harper
patent: 4295181 (1981-10-01), Chang et al.

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