Magnetic write head having a coil with submicron pitch

Details Magnetic write head having a coil with submicron pitch Magnetic write head having a coil with submicron pitch

1997-06-13

1999-12-21

Breneman, Bruce

Etching a substrate: processes

Forming or treating article containing magnetically...

216 72, 2960318, B44C 122

Patent

active

06004473&

ABSTRACT:
A method is provided wherein first and second sacrificial layers of a write element in a merged magnetic head are provided on top of a coil material layer, wherein the first sacrificial layer serves as a mask for shaping the coil material layer into a write coil, and the second sacrificial layer is employed for patterning the desired shape of the first sacrificial layer. The second sacrificial layer is shaped by a first reactive ion etching (RIE) step through a spiral opening in a photoresist layer. The result is a spiral-shaped second sacrificial layer that is employed as a mask for a second RIE to etch the first sacrificial layer through a spiral opening in the second sacrificial layer. The remaining spiral-shaped first sacrificial layer is then employed as a mask for ion milling the coil material layer through a spiral opening in the first sacrificial layer resulting in a write coil with a submicron pitch and sloping edges, which together increase a width of the base of the coil for increased current inducting capability.

REFERENCES:
patent: 4760481 (1988-07-01), Yuito et al.
patent: 4838994 (1989-06-01), Gulde et al.
patent: 5349745 (1994-09-01), Kawabe et al.
patent: 5578166 (1996-11-01), Hirota

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