Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Reexamination Certificate
2005-08-30
2005-08-30
Reichard, Dean A. (Department: 2831)
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
C174S034000, C174S033000, C205S118000, C205S119000, C361S816000, C361S818000
Reexamination Certificate
active
06936763
ABSTRACT:
Shielded electronic integrated circuit apparatus (5) includes a substrate (10), with an eletronic integrated circuit (15) formed thereon, and a dielectric region (12) positioned on the electronic integrated circuit. The dielectric region and the substrate are substantially surrounded by lower and upper magnetic material regions (26, 30), deposited using electrochemical deposition, and magnetic material layers on each side (32, 34). Each of the lower and upper magnetic material regions preferably include a glue layer (36, 40), a seed layer (28, 24), and an electrochemically deposited magnetic material layer (26, 30). Generally, the electrochemically deposited magnetic material layer can be conveniently deposited by electroplating.
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Durlam Mark A.
Kyler Kelly
Molla Jaynal A.
Rizzo Nicholas D.
Roll Michael J.
Freescale Semiconductor Inc.
Goddard Patricia S.
Lee Jinhee
Reichard Dean A.
Vo Kim-Marie
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