Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2005-06-14
2005-06-14
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S659000, C257S660000, C257S704000, C257S710000, C257S729000, C257S921000, C438S003000
Reexamination Certificate
active
06906396
ABSTRACT:
Structures and methods for providing magnetic shielding for integrated circuits are disclosed. The shielding comprises a foil or sheet of magnetically permeable material applied to an outer surface of a molded (e.g., epoxy) integrated circuit package. The foil can be held in place by adhesive or by mechanical means. The thickness of the shielding can be tailored to a customer's specific needs, and can be applied after all high temperature processing, such that a degaussed shield can be provided despite use of strong magnetic fields during high temperature processing, which fields are employed to maintain pinned magnetic layers within the integrated circuit.
REFERENCES:
patent: 4953002 (1990-08-01), Nelson et al.
patent: 5387551 (1995-02-01), Mizoguchi et al.
patent: 5406117 (1995-04-01), Dlugokecki et al.
patent: 5561265 (1996-10-01), Livshits et al.
patent: 5635754 (1997-06-01), Strobel et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5650659 (1997-07-01), Mostafazadeh et al.
patent: 5736070 (1998-04-01), Murakami et al.
patent: 5751553 (1998-05-01), Clayton
patent: 5763824 (1998-06-01), King et al.
patent: 5825042 (1998-10-01), Strobel et al.
patent: 5831331 (1998-11-01), Lee
patent: 5866942 (1999-02-01), Suzuki et al.
patent: 5889316 (1999-03-01), Strobel et al.
patent: 5902690 (1999-05-01), Tracy et al.
patent: 5939772 (1999-08-01), Hurst et al.
patent: 6027948 (2000-02-01), Jensen et al.
patent: 6097080 (2000-08-01), Nakanishi et al.
patent: 6515352 (2000-11-01), Taki et al.
patent: 6174737 (2001-01-01), Durlam et al.
patent: 6429044 (2002-08-01), Tuttle
“Easy BGA Packaging for Intel® Flash Memory Devices: Product Overview,” Intel.com, (2001), pp. 1-3.
“Overview Of Intel Packaging Technology,” 1999 Packaging Databook, Ch. 1., pp. 1-2.
“Preliminary Mechanical and Shipping Media Information for Easy BGA Packages,” Easy BGA Mechanical Specification, (May 2000), pp. 1-6.
“The Chip Scale Package (CSP),” 2000 Packaging Databook, Ch. 15, pp. 1-12.
Mahajan et al., “The Evolution of Microprocessor Packaging,” Intel Technology Journal Q3, (2000), pp. 1-10.
Deak James G.
Tuttle Mark E.
Knobbe Martens Olson & Bear LLP
Micro)n Technology, Inc.
Tran Mai-Huong
LandOfFree
Magnetic shield for integrated circuit packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Magnetic shield for integrated circuit packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Magnetic shield for integrated circuit packaging will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3510709