Magnetic sensor module

Details Magnetic sensor module Magnetic sensor module

2011-01-11

2011-01-11

Aurora, Reena (Department: 2858)

Electricity: measuring and testing

Magnetic

Magnetometers

C324S260000, C324S262000, C257S784000

Reexamination Certificate

active

07868612

ABSTRACT:
In a magnetic sensor module, using die-bond resin as a joining material, a Z-axis magnetic sensor is mounted onto a substrate having a wire formed on its principal surface. The Z-axis magnetic sensor having electrode pads formed on its bottom surface is tilted by 90 degrees and mounted onto the substrate. Therefore, the electrode pads are positioned at a side surface thereof. A joining material accommodation area which the die-bond resin can fill is provided at the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate. This joining material accommodation area has a grooved structure. At the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate, the grooved structure is provided at an end portion near the wire formed on the substrate.

REFERENCES:
patent: 2000-155922 (2000-06-01), None
patent: 2002-215428 (2002-08-01), None
patent: 2007-178203 (2007-07-01), None

Affiliated with

Also associated with

Rating

Magnetic sensor module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Magnetic sensor module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Magnetic sensor module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2737054