Magnetic sensing robotics for automated semiconductor wafer proc

Details Magnetic sensing robotics for automated semiconductor wafer proc Magnetic sensing robotics for automated semiconductor wafer proc

1996-05-09

1997-09-16

Ip, Paul

Electricity: motive power systems

Positional servo systems

Program- or pattern-controlled systems

3185681, 31856812, 414730, 414217, 414938, 34 58, B25J 500, F26B 1724

Patent

active

056684525

ABSTRACT:
A collision avoidance technique is provided in an automated semiconductor wafer processing system, wherein a magnet or magnetic strip is incorporated into each boat or carrier used to hold and transport the semiconductor wafers during the IC fabrication process. Additionally, a magnetic field sensing device is incorporated into the robotic arm of the system for sensing the presence of magnetic fields generated by the magnet(s) incorporated into the boats and/or carriers. Using this system, it is possible for the automated system controller to determine whether an imminent collision is about to occur by monitoring changes in the detected magnetic field. In this way, collisions between one boat/carrier and a second boat/carrier may be anticipated and avoided without relying upon physical contact between the two objects in order to detect collision.

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