Magnetic sensing element having reactive-ion-etching stop...

Details Magnetic sensing element having reactive-ion-etching stop... Magnetic sensing element having reactive-ion-etching stop...

2006-06-15

2009-11-24

Wellington, Andrea L (Department: 2627)

Dynamic magnetic information storage or retrieval

Head

Magnetoresistive reproducing head

C360S324200

Reexamination Certificate

active

07623324

ABSTRACT:
A magnetic sensing element including a laminate and a bias layer is provided. A first reactive-ion-etching (RIE) stop layer is disposed on a free magnetic layer. Second RIE stop layers are disposed on bias layers. The first and second RIE stop layers function as stop layers when layers on the first and second RIE stop layers are removed by reactive ion etching in a production process. Reactive ion etching is completed when the first RIE stop layer and the second RIE stop layers are exposed, the first and second RIE stop layers being disposed at almost the same height. Also provided is a process for producing the magnetic sensing element.

REFERENCES:
patent: 6967825 (2005-11-01), Gill
patent: 7271982 (2007-09-01), MacDonald et al.
patent: 7390584 (2008-06-01), Daughton et al.
patent: 2003/0179496 (2003-09-01), Jayasekara
patent: 2003/0190460 (2003-10-01), Hasegawa et al.
patent: 2004/0207959 (2004-10-01), Saito
patent: 2004/0207960 (2004-10-01), Saito et al.
patent: 2004/0207962 (2004-10-01), Saito et al.
patent: 2006/0158790 (2006-07-01), Freitag et al.
patent: 2004-335071 (2004-11-01), None
patent: 2005-44489 (2005-02-01), None

Affiliated with

Also associated with

Rating

Magnetic sensing element having reactive-ion-etching stop... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Magnetic sensing element having reactive-ion-etching stop..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Magnetic sensing element having reactive-ion-etching stop... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4099559