Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-03-15
2011-03-15
Chu, Chris (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257SE23101, C257S704000, C257S706000, C438S108000, C438S125000
Reexamination Certificate
active
07906376
ABSTRACT:
A semiconductor package is described. The semiconductor package includes a substrate and an integrated heat spreader disposed above and coupled with the substrate. A cavity is disposed between the substrate and the integrated heat spreader. A semiconductor die is disposed above the substrate and in the cavity. An array of first-level solder joints is disposed between the substrate and the semiconductor die. A layer of magnetic particle-based composite material is also disposed in the cavity.
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Blakely , Sokoloff, Taylor & Zafman LLP
Chu Chris
Intel Corporation
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