Magnetic insert into mold cavity to prevent resin bleeding from

Details Magnetic insert into mold cavity to prevent resin bleeding from Magnetic insert into mold cavity to prevent resin bleeding from

1999-08-06

2000-11-14

Elms, Richard

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438745, 438747, 438748, 438749, H01L 2144, H01L 21302

Patent

active

061469246

ABSTRACT:
A new method is provided for the creation of a pre-molded chip carrier. The invention teaches putting magnetic inserts into the upper mold. The magnetic inserts attract the lead fingers that are inserted into the upper mold during the process of filling the cavity with a compound pressing the lead fingers tightly against the surface of the magnet. The possibility of mold compound spilling over the lead fingers and forming resin depositions on the surface of the lead fingers is thereby voided.

REFERENCES:
patent: 4705205 (1987-11-01), Allen et al.
patent: 4966556 (1990-10-01), Reymond et al.
patent: 5263583 (1993-11-01), Ohashi
patent: 5366380 (1994-11-01), Reymond
patent: 5469334 (1995-11-01), Balakrishnan
patent: 5766496 (1998-06-01), Martin
patent: 5768108 (1998-06-01), Miura et al.
patent: 5841190 (1998-11-01), Noda et al.

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