Magnetic hold-down for foil substrate processing

Details Magnetic hold-down for foil substrate processing Magnetic hold-down for foil substrate processing

2009-04-16

2011-12-13

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S843000, C029S846000, C029S860000, C029S876000, C156S247000, C156S379600, C428S138000, C428S426000, C428S448000

Reexamination Certificate

active

08074349

ABSTRACT:
A method for forming an electronic circuit disposes a plurality of magnets onto a flux plate to form a magnetic platen. A substrate package is formed using the magnetic platen and, stacked against the magnetic platen, a non-magnetic carrier and a substrate layer, with a bonding material sandwiched between the carrier and the substrate layer, and with the carrier layer disposed nearest the magnetic platen. A fused wafer stack is formed by heating the substrate package to adhere the substrate layer to the carrier. The fused wafer stack is removed from the magnetic platen and the circuit fabricated on the substrate layer.

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patent: 4683653 (1987-08-01), Iwasa
patent: 5777402 (1998-07-01), Chitayat
patent: 6098282 (2000-08-01), Frankeny et al.
patent: 6492201 (2002-12-01), Haba
patent: 2008/0026581 (2008-01-01), Tredwell et al.
patent: 2008/0090338 (2008-04-01), Tredwell et al.
Commonly Assigned -U.S. Appl. No. 12/028,182 entitled “Method for Forming an Electronic Device on a Substrate Supported by a Carrier and Resultant Device”, filed Feb. 8, 2008, in the name of Roger Kerr et al.
Commonly assigned: U.S. Appl. No. 12/028,194 entitled “Method for Forming an Electronic Device on a Flexible Substrate Supported on a Detachable Carrier”, filed Feb. 8, 2008, in the name of Roger Kerr et al.

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