Magnetic head substructure for use for manufacturing a...

Details Magnetic head substructure for use for manufacturing a... Magnetic head substructure for use for manufacturing a...

2007-12-06

2010-12-21

Kim, Paul D (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S417000, C029S603070, C029S603230, C360S121000, C360S122000, C360S317000, C451S005000, C451S008000, C451S010000, C451S036000, C451S037000

Reexamination Certificate

active

07854060

ABSTRACT:
A substructure in which a plurality of pre-head portions are aligned in rows is to be cut later so that the pre-head portions are separated from one another. A surface formed by cutting the substructure is lapped to form medium facing surfaces. The substructure includes a plurality of sensors that respectively show individual sensor values corresponding to values of a plurality of different parameters each of which has an influence on characteristics relating to the pole layer and each of which depends on the position of the medium facing surface. The individual sensor values are resistance values each of which varies according to the position of the medium facing surface. The plurality of sensors are electrically connected to each other to form a composite sensor that shows a composite sensor value, which is a resistance value that depends on the resistance values of the plurality of sensors.

REFERENCES:
patent: 6557241 (2003-05-01), Sasaki
patent: 6807722 (2004-10-01), Sasaki et al.
patent: 7336442 (2008-02-01), Sasaki et al.
patent: 2006/0028770 (2006-02-01), Etoh et al.
patent: 2006/0044683 (2006-03-01), Matono et al.
patent: A-2000-251222 (2000-09-01), None
patent: A-2006-048806 (2006-02-01), None
patent: A-2006-073088 (2006-03-01), None

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