Magnetic head/silicon chip integration method

Details Magnetic head/silicon chip integration method Magnetic head/silicon chip integration method

1996-10-08

1999-02-09

Johnson, Linda

Metal working

Method of mechanical manufacture

Electrical device making

360103, H01L 2128, H01L 21301, H01L 21304, H01L 2148

Patent

active

058678883

ABSTRACT:
A method of integrating slider/head assemblies with silicon chips. The method facilitates the integration of silicon chips containing desirable circuits such as electrostatic discharge protection with slider/head designs such that the slider/head design may be selected independently of the type of silicon chip as long as compatible dimensions are used for each. First a bar of N slider/head assemblies is formed. A bar of N silicon chips is formed and then coupled to the bar of N slider/head assemblies to form an integrated bar of N slider/head/silicon chip units. Leads between the silicon chips and the slider/head assemblies are established. Finally, the integrated bar of N slider/head/silicon chip units is diced into N individual slider/head/silicon chip units. The method also includes the step of lapping the bar of N slider/head assemblies to form magnetic head air bearing surfaces and machining the bar of N slider/head assemblies to decrease the weight of the N slider/head assemblies.

REFERENCES:
patent: 4246695 (1981-01-01), Tsui
patent: 4333229 (1982-06-01), Ellenberger
patent: 4951381 (1990-08-01), Yamazaki et al.
patent: 5095613 (1992-03-01), Hussinger et al.
patent: 5559051 (1996-09-01), Voldman et al.
patent: 5603156 (1997-02-01), Biskeborn et al.

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