Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1998-09-14
2000-09-19
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
438692, H01L 21302, H01L 21461
Patent
active
061211427
ABSTRACT:
The present invention provides, for use with a polishing apparatus, a carrier structure comprising a first magnetic body, a second magnetic body, and a retaining ring. In one advantageous embodiment, the first magnetic body has a first side coupleable to the polishing apparatus, and a second side. The second magnetic body has a first side proximate and juxtaposed the second side of the first magnetic body. The second magnetic body is coupled to the first magnetic body to allow undulant motion with respect to the first magnetic body. The first and second magnetic bodies are configured to have a like polarity. The retaining ring is coupled to the second side of the second magnetic body and forms a retaining cavity configured to receive an object to be polished. Thus, the first and second magnetic bodies may cooperate to form a frictionless gimbal.
REFERENCES:
patent: 5242524 (1993-09-01), Leach et al.
patent: 5559428 (1996-09-01), Li et al.
patent: 5607341 (1997-03-01), Leach
patent: 5618447 (1997-04-01), Sandhu
patent: 5882243 (1999-03-01), Das et al.
Crevasse Annette M.
Easter William G.
Maze John A.
Deo Duy-Vu
Lucent Technologies - Inc.
Utech Benjamin L.
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