Communications: electrical – Digital comparator systems
Patent
1975-05-29
1977-03-15
Witkowski, Stanley J.
Communications: electrical
Digital comparator systems
29604, 174 52PE, 174 52FP, 357 72, 340324M, G11C 1908
Patent
active
040127230
ABSTRACT:
Magnetic bubble chips are packaged along with X, Y and Z magnetic field generating means. The package is comprised of a metal lead frame upon which a magnetic bubble chip such as a memory chip device is mounted. Connectors are utilized to connect terminal pads on the bubble memory device to selected lead frame conductors. The lead frame includes selectively positioned terminal conductors which provide exterior terminals for X and Y magnetic field generating coils. The lead frame is plastic encapsulated with the plastic being formed to completely seal the magnetic bubble chip and connectors while providing mechanical support channels for X and Y magnetic field coils. Openings are provided in the plastic within the channels parallel to the plane of the lead frame on opposite sides thereof exposing the selectively positioned conductors so that the coils are electrically connected to the lead frame terminal conductors. Permanent magnets are provided on either end of the structure and magnetic field spreading plates are provided over the top and bottom of the structure parallel to the plane of the lead frame to generate a constant Z magnetic field.
REFERENCES:
patent: 3668688 (1972-06-01), Schmersal
patent: 3784725 (1974-01-01), Perkins et al.
patent: 3836896 (1974-09-01), Rifkin
Michaelis et al., Magnetic Bubble Mass Memory--Module Design and Operation, IEEE Transactions on Magnetics, vol. MAG-9, No. 3, Sept. 1973, pp. 436-440, copyright 1973.
IBM Technical Disclosure Bulletin, vol. 13, No. 12, May, 1971, p. 3704.
IBM Technical Disclosure Bulletin, vol. 16, No. 7, Dec., 1973, pp. 2129-2130.
Grossman Rene E.
Levine Harold
Sadacca Stephen S.
Texas Instruments Incorporated
Witkowski Stanley J.
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