Magnetic bubble memory module with interconnection member

Static information storage and retrieval – Magnetic bubbles – Disposition of elements

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365 28, G11C 1908

Patent

active

049758713

ABSTRACT:
According to one embodiment of the present invention, a magnetic bubble memory module comprising a flexible printed circuits substrate (FPC3), on which a magnetic bubble memory chip (CHI) is mounted and electrically connected, with interconnecting patterns (9a) electrically connecting the chip (CHI) with external connecting leads, terminals or pins as well as bias coil winding (BIC2) for applying bias field to the chip (CHI), thereby reducing the number of components as well as fabricating steps because of the formation of the bias coil (BIC2) with the printed circuits substrate (FPC3).

REFERENCES:
patent: 4165535 (1979-08-01), Mortelmans et al.
patent: 4180863 (1979-12-01), Joshi
patent: 4592015 (1986-05-01), Akiba et al.

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