Etching a substrate: processes – Forming or treating article containing magnetically...
Patent
1996-01-31
1998-09-22
Powell, William
Etching a substrate: processes
Forming or treating article containing magnetically...
216 41, B44C 122
Patent
active
058110186
ABSTRACT:
The present invention discloses an improved structure and method for forming an interleaved magnetic head. In one aspect, an interleaved magnetic head is formed by providing a wafer comprising a first thick magnetic layer extending across read and write segments of the head and patterned to form a first read shield and a first write pole and, in a second step, a second thick magnetic layer is formed across the read and write segments of the head at substantially the same time to provide substantially all of a second read shield and substantially all of a second write pole. A write gap between the write poles may be formed in such a manner as to have a different thickness than the read gap between the read shields. In addition, tight processing control is maintained over the critical read gap thickness.
REFERENCES:
patent: 5141623 (1992-08-01), Cohen et al.
patent: 5296993 (1994-03-01), Aboaf et al.
patent: 5363265 (1994-11-01), Hsie et al.
patent: 5435053 (1995-07-01), Krounbi et al.
Kelley et al., "High-Track-Density, Coupled-Film Magnetoresistive Head", pp. 2890-2892, 1981, IEEE Transactions on Magnetics, vol. Mag-17, No. 6, Nov.
Cates James C.
Ewasko Diane C.
Powell William
Storage Technology Corporation
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