Magnet unit and magnetron sputtering apparatus

Details Magnet unit and magnetron sputtering apparatus Magnet unit and magnetron sputtering apparatus

2009-07-09

2011-11-01

McDonald, Rodney (Department: 1724)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298200

Reexamination Certificate

active

08048277

ABSTRACT:
A magnet unit, which can realize uniform film thickness distribution of a thin film formed on a substrate without increasing the length and width of a target. The magnet unit includes a peripheral magnet, which is disposed on the yoke on the back side of a cathode electrode so as to follow the outline of a target, and an inner magnet disposed in the peripheral magnet and having a polarity different from the polarity of the peripheral magnet. The magnet unit provides a magnetic track MT that is a set of regions which tangents of magnetic field lines M generated on the target parallels to the target surface. The magnet unit further includes n (n is a positive integer of two or more) extending magnetic pole portions and n−1 projecting magnetic pole portions, which form 2n−1 folded shape portions U at the both ends in the longitudinal direction of the magnetic track.

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