Magnesium composite electronic packages

Stock material or miscellaneous articles – Composite – Of metal

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Details

428472, 428614, 428698, 428704, C22C 1500

Patent

active

056724330

ABSTRACT:
The present invention is a system comprising an element having a specific coefficient of thermal expansion and a metal matrix composite having a coefficient of thermal expansion which essentially matches that of the element. The composite is in contact with the element such that heat can be transferred therebetween. The composite comprises reinforcement material infiltrated with a matrix material having magnesium or a magnesium alloy. If desired, inserts may be loaded into the mold to create specific features in the resulting composite. Other inserts such as other metals, tubes or leachable cores may be used to create features inside of the magnesium composite such as metal seal rings made out of kovar or stainless steel cooling channels or substrates. Preferably, magnesium is infiltrated, assisted by pressure, into reinforcement material to form a metal matrix composite comprised of a reinforcement material infiltrated with matrix material surrounded by a pure metal skin of magnesium. These magnesium composites with hermetic skins are ideal for many applications including electronic packages for housing an electronic component because they offer lighter weight and high conductivity. The present invention is also a method which comprises the steps of forming a metal matrix composite comprised of reinforcement material filled with a matrix material having magnesium such that the composite has a specific coefficient of thermal expansion. Then, there is the step of connecting an element, such as an electronic device, having a coefficient of thermal expansion which essentially matches that of the composite to the composite.

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