Machine process for routing interconnections from one module to

Details Machine process for routing interconnections from one module to Machine process for routing interconnections from one module to

1989-08-07

1990-10-23

Arnold, Bruce Y.

Boots, shoes, and leggings

364488, 364489, 364490, G06F 1560

Patent

active

049657399

ABSTRACT:
In the present disclosure, a method of routing interconnections between a semiconductor module and another semiconductor module in a planar field by the use of a digital computer program is disclosed. The method is a variation of the prior art YACR method. The method provides for variable width track routing, as well as cost equation for net assignment and cost equation of net chosen to particular a horizontal track. The present invention also relates to a method for positioning the modules. The method of positioning the two modules or compacting the modules is a method for moving tracks between modules from one module to the other module as close to the opposite module as possible within the design rule constraints. The tracks are then moved in an opposite direction and the straightest segment to minimize jogs is chosen. Each track is then moved in the opposite direction and is moved as close to the straightest previous adjacent track as possible, within the design rule constraint.

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Rabbie et al; "Gridless Channel Routing and Compaction for Cell-Based Custom IC Layout"; Custom Integrated Circuits Conference, IEEE 1986; pp. 297-299.

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