Machine for unloading micro-electronic beam lead chips

Details Machine for unloading micro-electronic beam lead chips Machine for unloading micro-electronic beam lead chips

1975-06-30

1976-06-08

Jones, Jr., James L.

Metal working

Means to assemble or disassemble

To apply or remove a resilient article

29200D, B23P 1902

Patent

active

039614093

ABSTRACT:
This invention is directed to a machine for unloading micro-electronic beam lead devices from a carrier. The machine removes the resilient clip, base and circuit board from the cover and the chip so that the beam lead chip is exposed and can be picked up and bonded onto a hybrid circuit substrate.

REFERENCES:
patent: 3268991 (1966-08-01), Beinhaur
patent: 3791004 (1974-02-01), Crawford et al.
patent: 3859706 (1975-01-01), Williams et al.
patent: 3903576 (1975-09-01), Stein

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