Machine for ultrasonically bonding wires to cavity-down integrat

Details Machine for ultrasonically bonding wires to cavity-down integrat Machine for ultrasonically bonding wires to cavity-down integrat

1984-09-14

1986-03-18

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

B23K 3700

Patent

active

045763224

ABSTRACT:
A machine for bonding a wire between pads on an integrated circuit die and a cavity-down circuit package includes a wedge for transferring heat energy to one part of the wire of sufficient magnitude to bond it to the pads, a clamp for grasping and pulling on another part of the wire to break it after the bonding operation, and a positioning mechanism for moving the wedge and clamp to selectable bonding locations over the die and package; wherein both the wedge and clamp include respective passageways through which the wire is threaded and slides; the clamp moves the portion of the wire between the passageways to a first position where it makes a large angle with the wedge, and to a second position where it makes a substantially smaller angle with the wedge; and the wedge is adapted to pass the wire without bending it at both the large and small angles.

REFERENCES:
patent: 3328875 (1967-07-01), Pennings
patent: 3648354 (1972-03-01), Mashino et al.
patent: 3787966 (1974-01-01), Klossika
patent: 4527730 (1985-07-01), Shirai et al.

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