Machine for stripping wafers

Details Machine for stripping wafers Machine for stripping wafers

1988-02-01

1989-07-25

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

Sequential work treating receptacles or stations with means...

134 95, 134134, 134140, 134159, B08B 302

Patent

active

048503819

ABSTRACT:
Apparatus for stripping photoresist and other coatings from integrated circuit wafers comprises a series of vertically positioned casings with rotary turrets within each casing each accommodating approximately 10 wafers. Wafers are received in conventional "boats", lifted one at a time and inserted in a pocket in the first turret. The turret indexes intermittently, immersing the wafer in solvent until it travels almost a full 360.degree.; the wafer is then lifted from the first turret and inserted in a second turret which immerses the wafer during another almost 360.degree. travel in additional solvent. Toward the end of travel in the second turret a spray nozzle strips all remaining photoresist from the wafer. The wafer is then lifted from the second turret and inserted in a first pocket, optionally containing alcohol. The wafer is then lifted from the first pocket and inserted in a third turret which immerses the wafer in de-ionized water, such water being sprayed on the wafer to rinse away all stripper and/or alcohol. Next the wafer is inserted in a second pocket where an air or nitrogen spray dries the wafer. The wafer is then deposited in a second boat.

REFERENCES:
patent: 1432578 (1922-10-01), Thomas et al.
patent: 3970471 (1976-07-01), Bankes et al.
patent: 4119108 (1978-10-01), Alexander
patent: 4208760 (1980-06-01), Dexter et al.
patent: 4282825 (1981-08-01), Nagatomo
patent: 4722355 (1988-02-01), Moe et al.

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