Machine for laser reflow soldering

Details Machine for laser reflow soldering Machine for laser reflow soldering

1996-05-30

1998-06-09

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

B23K 2608, B23K 2612

Patent

active

057638543

ABSTRACT:
A machine for connecting leads of a substrate to solder pads, the machine including a motor moving a conveyor for automatically positioning the substrate in the machine so that a bottom side of the substrate has a lead placed in contact with a solder pad without flux for reflow soldering. Additionally, a laser is present to heat the solder pad in an atmosphere of an inert gas mixed with formic acid for reflow soldering of the lead to the reflowed solder pad. A probe can be used to press the lead against the solder pad which may be made of Molybdenum to prevent solder adhesion. The solder pad can be made of 20% tin and 80% lead.

REFERENCES:
patent: 4646958 (1987-03-01), Howard, Jr.
patent: 4745684 (1988-05-01), Brown et al.
patent: 4937006 (1990-06-01), Bickford et al.
patent: 5023426 (1991-06-01), Prokosch et al.
patent: 5055652 (1991-10-01), Jones et al.
patent: 5090651 (1992-02-01), Mittag
patent: 5122635 (1992-06-01), Knodler et al.
patent: 5194710 (1993-03-01), McDaniel et al.
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5227604 (1993-07-01), Freedman
patent: 5309273 (1994-05-01), Mori et al.

Affiliated with

Also associated with

Rating

Machine for laser reflow soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Machine for laser reflow soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Machine for laser reflow soldering will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2202785