Machine for filling via holes in an integrated circuit package w

Details Machine for filling via holes in an integrated circuit package w Machine for filling via holes in an integrated circuit package w

1984-04-02

1985-05-28

Hoag, Willard E.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Extrusion shaping means

101126, 101129, 118213, 425129R, 425406, 425417, B29C 300, B29F 301, B05C 100

Patent

active

045197601

ABSTRACT:
A machine for filling a plurality of via holes in a workpiece comprises a hollow member having an open face; a masking member covering the face and having a plurality of holes which are arranged across the face such that they match the via holes in the workpiece; a diaphragm inside of the hollow member having a front surface that forms a first cavity with the masking member for receiving a high viscosity conductive ink and having a back surface that forms a second cavity with the hollow member; a means for holding the workpiece against the masking member such that their respective holes are aligned; and an orifice in the hollow member for introducing a fluid under pressure into the second cavity and against the back surface of the diaphragm to thereby squeeze a portion of the high viscosity ink through the holes of the masking member and into the holes of the workpiece.

REFERENCES:
patent: 3172358 (1965-03-01), Weiss
patent: 3226255 (1965-12-01), Cieniewicz et al.
patent: 3530792 (1970-09-01), Valieia
patent: 4043683 (1977-08-01), Costa et al.
patent: 4094716 (1978-06-01), Lopez

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